Clad Metals for Electronic Packaging
Material Feature
Now we have devised and manufactured such clad metals to meet all kinds of demands including CIC and CMC which are the most popular in applications. All of them are composed of low thermal expansion coefficient material and high heat conductivity material through metallurgical bonding. Excellent bonding strength integrated each component's advantage. Also the thermal expansion coefficient and heat conductivity of clad metals can be adjusted by changing the layer ratios. Besides the above virtues, lower cost of some clad metals is also attractive to users. So clad metals are always taken into consideration in electronic packaging.
The properties of the example clad metals and traditional heat sink material Mo are described in below table. From the table, it is shown that the properties is almost equivalent between CIC-1 and Mo. And the advantages of lower gravity, easier shape deforming and plating Ni or Sn well make it possible to be widely used in heat spreader, chip to chip's interconnector, lead frames, hybrid circuit case bottoms and MCM cape in power semiconductors such as SCR, transistor module, SSR and IC packaging fields. The another reason that we specially recommend CIC-1 is lower cost than pure Mo.
The Property of Clad Metals for CTE in Electronic Packagin
Notes:
1)To the CIC-1 and CMC, the thermal expansion coefficient, the heat conductivity and mechanical properties can be adjusted according to the users’ requirement.
2)It refers to the direction of parallel to the surface. In addition we have designed the special CIC which has higher vertical heat conductivity of more than 100 v/m.℃.
The shapes we supplied:
1) Strip coil;
2) Elements. We can supple to customer with discs, square pieces, and other special bending types. It is more than 20 types. Moreover, we can design and
manufacture them according customers’ special request.
The atlas
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